TiP 2013: The 2nd IEEE International Workshop on Tools in Process

Held in conjunction with COMPSAC, the IEEE Signature Conference on Computers, Software & Applications - July 22-26, 2013 - Kyoto, Japan


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Goal of the Workshop

The complexity of embedded systems and their architectures is growing rapidly. This is due to market demand for more functionality and to the non-stopping evolution/improvement of the available technologies, which are being integrated together in new and innovative ways. This complexity growth demands improved tool support, which are capable of providing adequate coverage of the embedded systems design and development process. At an individual tool level, specialized tools are available to cover novel necessary features of modern devices and provide support for most of the large tool frameworks phases of the design in a unitary environment. On the next level, the main solutions available for dealing with the current complexity challenges are addressed by integration frameworks and tool-chains that combine/integrate different tools together covering the whole embedded systems design and development process. The second Tools in Process workshop intend to gather and illustrate experiences in tools development and utilization in the area of embedded systems design. Starting with requirements elicitation, and ending with post deployment situations, all design phases are of interest with respect to the tooling solutions.

Theme and Scope of the Workshop

The theme of this workshop is Integration and tool interoperability. Today, it is not possible to cost-efficiently engineer high quality systems without an extensive use of different tools which work well together, covering as much as possible of the design process. Tool integration is a real challenge, and even more so when the tools are being used by engineering communities with different traditions and cultures.

Any submission whose content is relevant to the theme of tool interoperability and integration, but any submission whose subject matter is related to one of the following topics will be particularly welcome:

• New tool(s) developments / prototypes
• Experiences in tool utilization to address new challenges
• Tool integration strategies, technologies and solutions
• Success stories in the seamless integration of tool in the design process
• Tools in the support of long product life cycles

Submission

Papers must be submitted electronically via the TiP 2013 Submission Page.

Follow the IEEE Computer Society Press Proceedings Author Guidelines to prepare your papers: http://www.computer.org/portal/web/cscps/submission.

All papers will be carefully reviewed by at least three reviewers. Papers can be submitted as regular papers (six pages), and the acceptance will depend on reviewer feedback. Accepted papers will be published in the workshop proceedings of the IEEE Computer Software and Applications Conference (COMPSAC 2013) by the IEEE CS Press. At least one of the authors of each accepted paper must register as a full participant of the workshop to have the paper published in the proceedings. Each accepted paper must be presented in person by an author.

General Inquiries

For updated information, please contact the workshop organizers.


TiP Organizers

Tiberiu Seceleanu
ABB Corporate Research, Sweden
Email: tiberiu.seceleanu (at) se.abb.com

Jason Mansell
Tecnalia Research & Innovation, Spain
Email: jason.mansell (at) tecnalia.com

Program Committee

Martin Törngren, Royal Institute of Technology, Sweden
Birger Mřller-Pedersen, University of Oslo, Norway
Lubos Brim, Masaryk University, Czech Republic
Joel Champeau, ENSTA-Bretagne, France
Ali Koudri, Thales, France
David Mulvaney, Loughborough University, UK
Koen Bertels, Delft University of Technology, The Netherlands
Stein-Erik Ellevseth, ABB Corporate Research, Norway
Jose Manuel, IXION, Spain
Radouane Oudrhiri, Systonomy, UK
Oliver Sims, SELEX GALILEO, UK

Workshops Program Deadlines

• Extended: April 8, 2013 : Workshop papers due
• April 26, 2013: Workshop paper notifications
• May 5, 2013: Camera-ready copy and registration due